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Пакет device-mapper-libs-10:1.02.202-6.el10.x86_64 download

Имя device-mapper-libs
Эпоха 10
Версия 1.02.202
Релиз 6.el10
Архитектура x86_64
Сайт https://sourceware.org/lvm2
Лицензия LGPL-2.1-only
Время сборки 2025-04-02 21:10:06
Хост сборки builder-x86-08.inferitos.ru
Краткое описание Device-mapper shared library
Репозитории BaseOS
Полное описание This package contains the device-mapper shared library, libdevmapper.
Эррата
Размер 182 КиБ
Исходный проект lvm2-2.03.28-6.el10
Контрольная сумма SHA-256 b699cc963905a2ae822e6c2a69ce8190de9ac3b23a216fb2cc1b7e19d0dedae1
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История изменений link
* Tue Feb 04 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-6
- Fix race causing lvm2 not recognizing active devices.

* Thu Jan 23 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-5
- Add libnvme dependency to really fix the NVMe issue.

* Tue Jan 21 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-4
- Fix temporary LVs not cleaned when converting in use LV to a thin pool.
- Check FS resize is supported before extending LV.
- Fix issue affecting memory locking before suspend (2.03.27).
- Workaround for NVMe WWID changing after kernel update.

* Tue Nov 26 2024 MSVSphere Packaging Team <packager@msvsphere-os.ru> - 2.03.28-3
- Rebuilt for MSVSphere 10

* Thu Nov 14 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-3
- Fix duplicate LV names when converting pools to RAID1 with more than 2 legs.

* Wed Nov 13 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-2
- Fix input units for VDO LV's minimim_io_size.
- Fix stripe count and validation for RAID LVs.

* Tue Nov 05 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-1
- Update to upstream version 2.03.28.
- See WHATS_NEW and WHATS_NEW_DM for more information.

* Wed Oct 02 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.27-1
- Update to upstream version 2.03.27.
- See WHATS_NEW and WHATS_NEW_DM for more information.

* Wed Sep 25 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.24-4
- Bump release.

* Thu Sep 19 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.24-3
- Bump release and rebuild.