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Package device-mapper-event-10:1.02.202-6.el10.aarch64 download

Name device-mapper-event
Epoch 10
Version 1.02.202
Release 6.el10
Architecture aarch64
Website/URL https://sourceware.org/lvm2
License GPL-2.0-only
Build Time 2025-04-02 21:29:54
Build Host builder-arm64-1.inferitos.ru
Summary Device-mapper event daemon
Repositories BaseOS
Description This package contains the dmeventd daemon for monitoring the state of device-mapper devices.
Errata
Size 33 KiB
Source Project lvm2-2.03.28-6.el10
SHA-256 checksum 7465ad834fedadcde4cce9a6dcda8480b715bbd8858cc59c08e6a8873e0a905a
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Changelog link
* Tue Feb 04 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-6
- Fix race causing lvm2 not recognizing active devices.

* Thu Jan 23 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-5
- Add libnvme dependency to really fix the NVMe issue.

* Tue Jan 21 2025 Marian Csontos <mcsontos@redhat.com> - 2.03.28-4
- Fix temporary LVs not cleaned when converting in use LV to a thin pool.
- Check FS resize is supported before extending LV.
- Fix issue affecting memory locking before suspend (2.03.27).
- Workaround for NVMe WWID changing after kernel update.

* Tue Nov 26 2024 MSVSphere Packaging Team <packager@msvsphere-os.ru> - 2.03.28-3
- Rebuilt for MSVSphere 10

* Thu Nov 14 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-3
- Fix duplicate LV names when converting pools to RAID1 with more than 2 legs.

* Wed Nov 13 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-2
- Fix input units for VDO LV's minimim_io_size.
- Fix stripe count and validation for RAID LVs.

* Tue Nov 05 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.28-1
- Update to upstream version 2.03.28.
- See WHATS_NEW and WHATS_NEW_DM for more information.

* Wed Oct 02 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.27-1
- Update to upstream version 2.03.27.
- See WHATS_NEW and WHATS_NEW_DM for more information.

* Wed Sep 25 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.24-4
- Bump release.

* Thu Sep 19 2024 Marian Csontos <mcsontos@redhat.com> - 2.03.24-3
- Bump release and rebuild.